| 摘要 |
A method for manufacturing a circuit board is provided to form an electroformed product finely by electroforming a conductor while spraying the air to the vent hole of the conductor. At least one vent hole is formed in a conductor by the etching, the laser, the ion beam or the punching. The adhesive mixture is filled in the vent hole. The adhesive mixture includes silicon, wax, and resin. The conductor is immersed in an electroforming bath with the electrolytic solution. A gas post is formed by spraying the gas to the vent hole of the conductor. The conductor is electroformed while spraying the gas to the vent hole. The electroformed conductor is drawn out from the electroforming bath. The adhesive mixture is removed from the vent hole of the electroformed conductor.
|
