发明名称 Light sensor embedded on printed circuit board
摘要 <p>A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). Such techniques may be used in connection with a light sensor. In certain example embodiments, a flexible printed circuit board (PCB) includes a light sensor comprising a light sensor flip-chip, with the light sensor flip-chip including at least two light sensor arrays, and with each said sensor array being configured to sense light of a predetermined wavelength. An adhesive bonds the light sensor to the PCB. A hole is formed in the PCB and the opaque layer so as to allow the light sensor arrays to see through the hole formed in the PCB and the opaque layer. A state of the vehicle lights is settable in dependence on the light sensor. The PCB is located in or is supported by the vehicle windshield.</p>
申请公布号 EP2100722(A2) 申请公布日期 2009.09.16
申请号 EP20090155253 申请日期 2009.03.16
申请人 GUARDIAN INDUSTRIES CORP. 发明人 VEERASAMY, VIJAYEN S.
分类号 B32B17/10;B60S1/08;G01D5/00;G01N27/22 主分类号 B32B17/10
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