发明名称 FABRICATION METHOD OF PRINTED CIRCUIT BOARD
摘要 A manufacturing method of a PCB is provided to form fine roughness on a surface of a board with manufacture of the board by forming fine unevenness on an inner surface of a mold. A fine unevenness is formed in an inner surface of a mold(S110). A thermoplastic material of a powder or molten state is filled inside the mold(S120). The thermoplastic material inside the mold is compression-molded or is injection-molded. A roughness corresponding to the fine unevenness is transferred on a surface of a board(S130). A circuit line is formed on a surface of the board(S140). The thermoplastic material is one among liquid crystal polymer, polyetherimide, polyethersulfone, polyetheretherketone, and polytetrafluorethylene.
申请公布号 KR20090097332(A) 申请公布日期 2009.09.16
申请号 KR20080022405 申请日期 2008.03.11
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, HWA YOUNG;PARK, HO JOON;KIM, JIN CHEOL;YOON, SANG JUN;YUN, GEUM HEE;OH, JUN ROK
分类号 H05K3/22 主分类号 H05K3/22
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