A manufacturing method of a PCB is provided to form fine roughness on a surface of a board with manufacture of the board by forming fine unevenness on an inner surface of a mold. A fine unevenness is formed in an inner surface of a mold(S110). A thermoplastic material of a powder or molten state is filled inside the mold(S120). The thermoplastic material inside the mold is compression-molded or is injection-molded. A roughness corresponding to the fine unevenness is transferred on a surface of a board(S130). A circuit line is formed on a surface of the board(S140). The thermoplastic material is one among liquid crystal polymer, polyetherimide, polyethersulfone, polyetheretherketone, and polytetrafluorethylene.
申请公布号
KR20090097332(A)
申请公布日期
2009.09.16
申请号
KR20080022405
申请日期
2008.03.11
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, HWA YOUNG;PARK, HO JOON;KIM, JIN CHEOL;YOON, SANG JUN;YUN, GEUM HEE;OH, JUN ROK