SEMICONDUCTOR PACKAGE AND THE MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and a manufacturing method thereof are provided to remove the void generated due to the step of an insulating layer and a solder resist by exposing only a wiring pattern to an upper part of the solder resist. A plurality of conductive bumps are formed in a semiconductor die(180). An insulating layer(110) includes a first copper thin film and a second copper thin film to be electrically connected to a conductive via. A first solder resist(130) exposes a part of the first wiring pattern to be electrically connected to the conductive bump. An underfill is formed in an outer circumference of the first wiring pattern and the conductive bump. A first wiring pattern(120) includes a first wiring layer(122) and a second wiring layer(124) which are successively stacked in the upper part of the first copper thin film.