| 摘要 |
A cleaning method for a substrate processing system capable of appropriately cleaning a housing chamber. In the substrate processing system, the number of execution times of product processing is accumulated, if the product processing to be executed next corresponds to first product processing for a subsequent lot, a time interval between preceding and subsequent lots is not longer than a predetermined time period, and a type of the last product processing performed for the preceding lot is the same as that of the first product processing to be performed for the subsequent lot. When the accumulated number of execution times is not less than a predetermined number of times, a cleaning treatment is executed, which corresponds to a chamber indicated in a system recipe set for a lot including a wafer on which the product processing is performed immediately before execution of the cleaning treatment.
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