| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To adequately suppress the scattering of a solder at the time of reflow soldering in a method for mounting an electronic component soldered on a board. <P>SOLUTION: The method for mounting the electronic component comprises the steps of reflowing the solder 20 after the electronic component is mounted on the board 10 through the solder 20, and soldering the electronic component 30 on the board 10. In the reflow step, in order to increase an evaporating temperature of a moisture included in the solder 20, the reflow soldering is conducted in an inert gas atmosphere, such as nitrogen gas, pressurized at 4 to 5atm for instance. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
