| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor element whose reliability is improved, and a method for manufacturing the semiconductor element. <P>SOLUTION: The semiconductor device 10 is provided with a semiconductor element 14, a conducting member which is electrically connected to the semiconductor element 14, a plating layer 16 which covers a surface of the conducting member, and sealing resin 13 for sealing the semiconductor element 14 and the conducting member. The plating layer 16 is composed of metal whose thermal conductivity is lower than that of the conducting member. As a result, exponential rise in temperature of the sealing resin accompanying heat generation of the semiconductor element can be prevented. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
