| 摘要 |
A continuous copper electroplating method is provided to prevent a plating failure by decomposing the components degrading the coating performance which are produced when dissolving supply salt of copper ion. A continuous copper electroplating method comprises the steps of preparing a plating tank(1) and a copper dissolving tank(2) different from the plating tank, moving a plating bath(b) to the copper dissolving tank and then to the plating tank so that the plating back is circulation between the plating and copper dissolving tanks, injecting supply salt of copper ion in the copper dissolving tank and dissolving it, and compensating the copper ion of the plating bath consumed by plating so that electroplating is continuously performed. An anode(11) and a cathode are not isolated or isolated so that the plating bath can move. The plating bath is moved toward the anode when moved from the copper dissolving tank to the plating tank. |
