发明名称 |
Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR |
摘要 |
In a Cr-Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr-Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr-Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr-Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr-Cu alloy, are also provided. |
申请公布号 |
EP1985718(A4) |
申请公布日期 |
2009.09.16 |
申请号 |
EP20070714628 |
申请日期 |
2007.02.14 |
申请人 |
JFE PRECISION CORPORATION;JFE STEEL CORPORATION |
发明人 |
TERAO, HOSHIAKI;OTA, HIROKI;KOBIKI, HIDEAKI;UENOSONO, SATOSHI |
分类号 |
C22C9/00;B21B3/00;B22F3/26;C22C1/08;C22C27/06;H01L23/373 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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