SEMICONDUCTOR PACKAGE AND MULTI-CHIP PACKAGE USING THE SAME

摘要

A semiconductor package and a multi chip package using the same are provided to stack more semiconductor chips in one package by reducing the thickness of the package and performing the connection of the minimum distance by not requiring an interposer chip. A chip pad(103) is formed on a substrate(101) including an integrated circuit. A semiconductor chip(110) includes a passivation layer(105) exposing a chip pad. A wire bonding pad(127a) is connected to the chip pad and is extended and formed on the semiconductor chip. A first rewiring layer(121) has a first solder pad for the connection of a second semiconductor chip. A second rewiring layer(131) has a second solder pad for the connection of a third semiconductor chip. The rewiring insulating layer includes an opening unit to expose the chip pad for the rewiring.