| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device and a treatment method which are capable of removing a resist film from the periphery of a substrate without adversely affecting an exposure system. SOLUTION: As shown in Figure (a), a solvent nozzle 95 is reciprocated by a moving mechanism 94 along each edge of a substrate G, for instance, twice or three times for each edge while a thinner is discharged from the solvent nozzle 95, whereby a resist film 70 is removed from only the periphery of the substrate G, and a treatment film 80 which is formed through an HMDS gas when an adhesion treatment is carried out is exposed. Then, as shown in Figure (b), an optical fiber 81 is reciprocated along each edge of the substrate G, for instance, twice or three times for each edge as the optical fiber 81 irradiates the substrate G with ultraviolet rays, whereby the treatment film 80 exposed only on the periphery of the substrate G is removed. By this setup, no amine gas occurs from the treatment film 80 exposed on the periphery of the substrate G, so that exposure lenses, mirrors, and other apparatuses can be prevented from getting cloudy. COPYRIGHT: (C)2003,JPO |
