发明名称 |
METAL SUBSTRATE FOR SIDE VIEW LED LAMP, SIDE VIEW TYPE LED PACKAGE USING THE SUBSTRATE AND METHOD OF MAKING THE LED PACKAGE |
摘要 |
A metal substrate for a side view led lamp, a side view type led package using a substrate, and a method of making the led package are provided to increase a radiation effect through the shortest distance by emitting heat in direction where a metal substrate is exposed. In a metal substrate for a side view led lamp, a side view type led package using a substrate, and a method of making the led package, a combination member(130) physically binds a first lead frame(110) and a second lead frame(120) electrically. A first lead frame is made of a metal frame and has a mount groove(112) for mounting the LED chip. A second lead frame is made of a metal material, and the LED chip is mounted in the mounting groove of the first lead frame. |
申请公布号 |
KR20090096943(A) |
申请公布日期 |
2009.09.15 |
申请号 |
KR20080022036 |
申请日期 |
2008.03.10 |
申请人 |
ITSWELL CO., LTD. |
发明人 |
JUNG, CHEON KI;SEO, CHANG SIK;KIM, JAE IN;PARK, JUNG WOON;CHOL, YONG SUK |
分类号 |
H01L33/54;H01L33/52;H01L33/62 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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