发明名称 METAL SUBSTRATE FOR SIDE VIEW LED LAMP, SIDE VIEW TYPE LED PACKAGE USING THE SUBSTRATE AND METHOD OF MAKING THE LED PACKAGE
摘要 A metal substrate for a side view led lamp, a side view type led package using a substrate, and a method of making the led package are provided to increase a radiation effect through the shortest distance by emitting heat in direction where a metal substrate is exposed. In a metal substrate for a side view led lamp, a side view type led package using a substrate, and a method of making the led package, a combination member(130) physically binds a first lead frame(110) and a second lead frame(120) electrically. A first lead frame is made of a metal frame and has a mount groove(112) for mounting the LED chip. A second lead frame is made of a metal material, and the LED chip is mounted in the mounting groove of the first lead frame.
申请公布号 KR20090096943(A) 申请公布日期 2009.09.15
申请号 KR20080022036 申请日期 2008.03.10
申请人 ITSWELL CO., LTD. 发明人 JUNG, CHEON KI;SEO, CHANG SIK;KIM, JAE IN;PARK, JUNG WOON;CHOL, YONG SUK
分类号 H01L33/54;H01L33/52;H01L33/62 主分类号 H01L33/54
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