发明名称 |
BENDING RELIABILITY TESTING APPARATUS OF FLEXIBLE PRINTED CIRCUIT BOARD USING A VACUUM SUCTION AND BENDING TEST METHOD USING THE SAME |
摘要 |
A testing device of bending reliability of a flexible substrate and a testing method using the same are provided to easily separate a flexible substrate from a short part by rotating the short part of a top board through a hinge part. A bottom board(120) is mounted on a base substrate(110). The bottom board fixes the other end of the flexible substrate. A top board(130) is mounted on the bottom board. The top board fixes one end of the flexible substrate. The top board performs a bending test of the flexible substrate through back and forth movement. A driving part provides a driving force to the top board. A vacuum suction part is formed in a top surface of the bottom board and a bottom surface of the top board in order to suck the flexible substrate. The vacuum suction part comprises a plurality of vacuum suction holes.
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申请公布号 |
KR20090097019(A) |
申请公布日期 |
2009.09.15 |
申请号 |
KR20080022161 |
申请日期 |
2008.03.10 |
申请人 |
SEO, SEUNG HWAN |
发明人 |
SEO, SEUNG HWAN;OH, SUN MO;PYO, JUNG CHUL |
分类号 |
H05K13/08 |
主分类号 |
H05K13/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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