METHOD OF MANUFACTURING SEMICONDUCTOR CHIP EMBEDDED PRINTED CIRCUIT BOARD

摘要

A manufacturing method of a semiconductor part-embedded PCB is provided to prevent damage to a semiconductor chip due to an external shock by embedding the semiconductor chip in the center of an inner layer. A CCL(copper clad layer) core(10) is cut. A copper foil circuit(11a,11b) is formed on a top surface of a bottom surface of the CCL core by selectively etching a first copper foil and a second copper foil of the CCL core according to a fixed circuit pattern. A cavity is formed in the CCL core by a laser drill process. A semiconductor chip is fixed to the second copper foil inside the cavity by an adhesive film. A CCL(50) is laminated on a top surface and a bottom surface of the CCL core. A via hole and a circuit are formed by etching the copper foil of the CCL according to the fixed circuit pattern.