发明名称 |
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND ELECTRONIC DEVICE |
摘要 |
<p>The switching speed and other capabilities of a compound semiconductor device will be improved. Provided is a semiconductor substrate provided with a silicon substrate, an insulation film formed on the silicon substrate and having an aperture with an aspect ratio of /3 or higher, and that reaches the silicon substrate, a compound semiconductor crystal formed in the aperture and which is a seed compound semiconductor crystal formed such that it protrudes upward from the surface of the insulation film, and a laterally grown compound semiconductor layer that is laterally grown on the insulation film with a specific surface of the seed compound semiconductor crystal as the seed surface.</p> |
申请公布号 |
WO2009110208(A1) |
申请公布日期 |
2009.09.11 |
申请号 |
WO2009JP00921 |
申请日期 |
2009.02.27 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED;HATA, MASAHIKO;TAKADA, TOMOYUKI |
发明人 |
HATA, MASAHIKO;TAKADA, TOMOYUKI |
分类号 |
H01L21/20;H01L21/205;H01L21/336;H01L21/338;H01L21/76;H01L21/762;H01L21/764;H01L21/8234;H01L27/08;H01L27/088;H01L29/778;H01L29/786;H01L29/812 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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