发明名称 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND ELECTRONIC DEVICE
摘要 <p>The switching speed and other capabilities of a compound semiconductor device will be improved. Provided is a semiconductor substrate provided with a silicon substrate, an insulation film formed on the silicon substrate and having an aperture with an aspect ratio of /3 or higher, and that reaches the silicon substrate, a compound semiconductor crystal formed in the aperture and which is a seed compound semiconductor crystal formed such that it protrudes upward from the surface of the insulation film, and a laterally grown compound semiconductor layer that is laterally grown on the insulation film with a specific surface of the seed compound semiconductor crystal as the seed surface.</p>
申请公布号 WO2009110208(A1) 申请公布日期 2009.09.11
申请号 WO2009JP00921 申请日期 2009.02.27
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED;HATA, MASAHIKO;TAKADA, TOMOYUKI 发明人 HATA, MASAHIKO;TAKADA, TOMOYUKI
分类号 H01L21/20;H01L21/205;H01L21/336;H01L21/338;H01L21/76;H01L21/762;H01L21/764;H01L21/8234;H01L27/08;H01L27/088;H01L29/778;H01L29/786;H01L29/812 主分类号 H01L21/20
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