MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

摘要

Provided are a mounting structure comprising a substrate and a semiconductor package mounted thereon which enables suppression of unnecessary electromagnetic radiation and improvement of drop impact resistance, and a method for manufacturing the same. A substrate (1) is provided with plural electrode pads (12) for mounting a semiconductor package thereon and plural electrode pads (13) electrically connected to a power/ground layer (17) on the surface thereof. A conductive wire rod (31) mechanically and electrically connected to the electrode pad (13) at at least two points is provided on the surface of the substrate (1) to improve the stiffness of the surface of the substrate (1). A semiconductor package (4) is mechanically and electrically connected to the surface of the substrate (1) by the electrode pad (12). The suppression of unnecessary electromagnetic radiation generated from a transmission signal and improvement of drop impact resistance are achieved by the conductive wire rod (31).