发明名称 STRUCTURE FOR ATTACHING COMPONENT HAVING HEATING BODY MOUNTED THEREON
摘要 <p>Provided is a structure for attaching a component having a heating body mounted thereon, wherein sizes are reduced and heat dissipating efficiency is improved by improving heat conduction efficiency. A plurality of protruding sections are formed on an attaching surface of a base plate (10), and the base plate (10) is attached to a heat dissipating member (17) by arranging a heat conductive sheet (18) formed of a material softer than the base plate (10) in between.</p>
申请公布号 WO2009110045(A1) 申请公布日期 2009.09.11
申请号 WO2008JP03685 申请日期 2008.12.10
申请人 KABUSHIKI KAISHA TOSHIBA;HASEGAWA, TSUYOSHI 发明人 HASEGAWA, TSUYOSHI
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
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