发明名称 |
MOUNTING METHOD OF ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method of electronic components capable of correcting component library data or the like so as not to dispose printed boards and mounted electronic components without interrupting the manufacturing of printed boards. <P>SOLUTION: With respect to a first printed board on which a manufacturing operation has started, a substrate recognition camera photographs a component mounting position of the printed board and a recognition processing device performs recognition processing to confirm its coordinates and mount an electronic component on a proper corrected mounting position before the electronic component is mounted to the printed board by a suction nozzle provided at a component mounting head. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009206377(A) |
申请公布日期 |
2009.09.10 |
申请号 |
JP20080048891 |
申请日期 |
2008.02.28 |
申请人 |
HITACHI HIGH-TECH INSTRUMENTS CO LTD |
发明人 |
WADA TOSHIAKI;OYAMA KAZUYOSHI;KAIZUMI KAZUYOSHI;HIRANO KATSUMI |
分类号 |
H05K13/08;H05K13/04 |
主分类号 |
H05K13/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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