| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing capable of exhibiting excellent flowability in molding even if an inorganic filler is highly charged to obtain predetermined flame retardancy, and a semiconductor device using the epoxy resin composition for sealing. SOLUTION: The epoxy resin composition essentially comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a coupling agent. The inorganic filler is spherical glass consisting of three components: 64-66 mass% of SiO<SB>2</SB>; 24-26 mass% of Al<SB>2</SB>O<SB>3</SB>; and 9-11 mass% of MgO. COPYRIGHT: (C)2009,JPO&INPIT
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