发明名称 BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding method for easily carrying out bonding work. SOLUTION: In this bonding method, a plurality of members are bonded together by putting an uncured adhesive 3 between adherends of a plurality of members 1 and 2 and curing the adhesive while bringing the adherends into pressure contact mutually. A plurality of members, between which the uncured adhesive is held between the adherends, are housed in an internal space B surrounded by a sheet material 13 having airtightness, by which the internal space is hermetically sealed from an external space C, and flexibility, and when the internal space is evacuated, the sheet material is brought into tight contact with at least one of a plurality of members by a differential pressure between the external space and the internal space so that the adhesive is cured while the adherends are brought into pressure contact with each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009203284(A) 申请公布日期 2009.09.10
申请号 JP20080044764 申请日期 2008.02.26
申请人 MEISEI IND CO LTD 发明人 KONDO TOSHIHARU;NAKAGAWA YUKIO;NISHIGORI YUTAKA
分类号 C09J5/00 主分类号 C09J5/00
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