| 摘要 |
A semiconductor package and a manufacturing method thereof are provided to improve transmission performance by exposing a surface of an antenna for UWB(Ultra Wide Band) communication to outside in a molding process. A semiconductor package includes a substrate(101), a semiconductor chip(102), an antenna(107), a molding material, and a protective film. The semiconductor chip and the antenna are mounted on the substrate. The antenna is electrically connected to the semiconductor chip. The antenna includes a radiation part(109), a microstrip line(110), and a connection lead(111). The microstrip line is extended from the radiation part. The connection lead is connected to an end part of the microstrip line. The molding material molds the semiconductor chip and the antenna. A surface of the antenna is exposed to outside. The protective film is formed on an exposed surface of the antenna.
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