| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which obtains a miniaturization/a thinning at a low cost and ensures a reliability, and a method of manufacturing the semiconductor device. <P>SOLUTION: The semiconductor device is constituted by: a semiconductor element 1; an organic board 2; a projection dam tape 3 provided in the organic board 2; a concave portion 4 provided between the semiconductor element 1 and the projection dam tape 3; paste 5 which bonds and fixes the semiconductor element 1 and the organic board 2; a metal wire 6 which electrically connects the semiconductor element 1 with the organic board 2; a sealing insulating material 7 which encloses and seals regions of the semiconductor element 1 and the metal wire 6; and a metal terminal 8 attached to an opposite side of the organic board 2 in which the semiconductor element 1 is not loaded. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
