| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring structure which suppresses thermal diffusion to a wiring layer to easily raise the temperature of a solder joint part up to a soldering temperature in a short time, and ensures high connection reliability between wiring layers. <P>SOLUTION: In the wiring structure 1, the wiring layer 2 includes: an annular conductor part 8 so formed as to surround a through-hole 3; an outer conductor part 11 arranged around the annular conductor part 8; and an annular insulating part 9 which separates the annular conductor part 8 and the outer conductor part 11 to insulate. The outer conductor part 11 includes a via hole 10 coupling wiring layers 2. At least one wiring layer 2 has a coupling conductor part 12 which bridges the insulating part 9 to couple the annular conductor part 8 and the outer conductor part 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
