| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor which has photo-transmittance necessary for the optical transmission of an optical semiconductor device such as a photo coupler and excels in reflow resistance and moisture absorption soldering heat resistance as well. <P>SOLUTION: The epoxy resin composition for sealing an optical semiconductor device comprises an epoxy resin, a curing agent, and an inorganic filler as essential components, 5-30 mass% dicyclopentadiene type epoxy resin based on the entire amount of the epoxy resin is incorporated as the epoxy resin, and 80-90 mass% spherical fused silica based on the entire amount of the epoxy resin composition for sealing an optical semiconductor is incorporated as the inorganic filler. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
