| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inspection apparatus for implementing an electrical signal inspection in a semiconductor element on which electrodes are disposed at a narrow pitch, reducing a load, stabilizing a contact characteristic, and improving the position accuracy of a tip of a contact terminal. <P>SOLUTION: A probe sheet 5 includes a cantilever structure, and is formed with the pyramid or truncated pyramid contact terminal 4 at the top by sequentially laminating thin films such as a metal film and a polyimide film on a silicon substrate as a mold material by using a photolithography technology. A fixing substrate 6 is fixed to the probe sheet 5. The probe sheet 5 is sequentially formed and laminated on the silicon substrate. A group of the cantilevered contact terminals 4 are collectively formed by fixing the substrate and removing the silicon substrate and the predetermined polyimide film by etching. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
