| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for grinding a back surface of a semiconductor wafer that protects unevenness of a wafer surface, prevents ingress of grinding wastes and grinding water to the surface of the wafer, and promotes breakage prevention of the wafer after grinding to preferably maintain an accuracy of an in-plane thickness of the back surface of the wafer when grinding the back surface of the semiconductor wafer having unevenness on the surface and method of grinding the back surface of the semiconductor wafer using the same. <P>SOLUTION: An adhesive sheet 4 for grinding a back surface of a semiconductor wafer is attached to a circuit-formation surface 5 when grinding the back surface of the semiconductor wafer 6. The sheet is composed of an adhesive layer 3, an interlayer 2, and a base 1 from a circuit-formation surface 5 side. A JIS-A hardness of the interlayer 2 is greater than 55 and smaller than 80. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
