| 摘要 |
PROBLEM TO BE SOLVED: To remove sludge without hindering the convection stirring of a plating solution in a plating tank. SOLUTION: The plating apparatus has: the plating tank 1 for storing the plating solution therein; a substrate-supporting part 3 which supports a substrate (S) to be treated so that the substrate (S) is connected to a cathode 6 while being brought into contact with the plating solution at the upper opening position of the plating tank 1; an anode 9 arranged in the plating tank 1; a solution-supplying means 4 which supplies the plating solution into the plating tank 1; and a solution-discharging means 5 which discharges the plating solution to the outside from the upper part of the plating tank 1. The solution-supplying means 4 has an outlet 11a through which the plating solution is spouted upward from the bottom of the plating tank 1, and has a sludge discharge port 22, formed in a radially outward side of the outlet 11a, through which the sludge (G) in the plating tank 1 is discharged. COPYRIGHT: (C)2009,JPO&INPIT
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