发明名称 |
SEMICONDUCTOR WAFER AND MANUFACTURING PROCESS FOR SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor wafer 1 has first scribe lines 31 in two mutually perpendicular directions which have a first width and divide the semiconductor wafer 1 into a plurality of areas; second scribe lines 32 which have a second width smaller than the first width and divide the area into a plurality of semiconductor chip areas 2; an electrode pad 5 formed along the edge of the semiconductor chip area 2; and a metal-containing accessory pattern 4 disposed in the scribe lines. In the second scribe lines 32, the accessory pattern 4 is absent in at least the outermost surface in an area adjacent to the edge having the electrode pad 5 in the chip area 2.
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申请公布号 |
US2009227088(A1) |
申请公布日期 |
2009.09.10 |
申请号 |
US20090465349 |
申请日期 |
2009.05.13 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KIDA TSUYOSHI;NODA TAKAMITSU |
分类号 |
H01L21/78;H01L21/301;H01L21/46;H01L23/544 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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