| 摘要 |
An exposure apparatus configured to expose a substrate using exposure light provided by a light source, comprises an optical element located in an optical path of the exposure light, a gas supply configured to supply a gas into a space including the optical path, a decomposing unit configured to process the gas supplied into the space, thereby decomposing a silicon-containing organic material in the gas, and a controller configured to control the decomposing unit to supply the gas processed by the decomposing unit to the optical element located in the space in at least an adhesion suppressed period for which adhesion of a silicon-containing organic material onto the optical element is to be suppressed, wherein the adhesion suppressed period starts when application of the exposure light onto the optical element is stopped, and ends when a predetermined time has elapsed from the start time.
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