发明名称 |
SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENT, LIGHT EMITTING ELEMENT PACKAGE, AND METHOD OF BONDING CERAMIC AND ALUMINUM |
摘要 |
<P>PROBLEM TO BE SOLVED: To enable efficient radiation of light emitted from a light emitting element mounted on a substrate and efficient release of heat generated in the light emitting element. <P>SOLUTION: A substrate for mounting the light emitting element is characterized in that an aluminum material is bonded to the other principal plane of a ceramic substrate wherein a light emitting element is loaded on the one principal plane. This aluminum material is bonded to the other principle plane and the contact plane of the aluminum material is shaped in accordance with the other principle plane. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009206200(A) |
申请公布日期 |
2009.09.10 |
申请号 |
JP20080045088 |
申请日期 |
2008.02.26 |
申请人 |
KYOCERA CORP |
发明人 |
TANAKA ATSUSHI;USHIO YOSHIHIRO |
分类号 |
C04B37/02;H01L33/48;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
C04B37/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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