发明名称 MULTILAYER CHIP CAPACITOR
摘要 A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.
申请公布号 US2009225492(A1) 申请公布日期 2009.09.10
申请号 US20080248476 申请日期 2008.10.09
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/005 主分类号 H01G4/005
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