发明名称 |
MULTILAYER CHIP CAPACITOR |
摘要 |
A multilayer chip capacitor includes a capacitor body including a stack of a plurality of dielectric layers and having first and second side faces and first and second end faces, a plurality of external electrodes of opposite polarity alternated on each of the first and second side faces, and a plurality of internal electrodes each including one or two leads extending to an outer face of the capacitor body and respectively connected to the external electrodes. A horizontal distance between leads of the internal electrodes of opposite polarity adjacent to each other in a stack direction is longer than a pitch between the external electrodes of opposite polarity adjacent to each other on the same side face of the capacitor body.
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申请公布号 |
US2009225492(A1) |
申请公布日期 |
2009.09.10 |
申请号 |
US20080248476 |
申请日期 |
2008.10.09 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DONG SEOK;PARK SANG SOO;PARK MIN CHEOL |
分类号 |
H01G4/005 |
主分类号 |
H01G4/005 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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