发明名称 DIFFERENT METALLIC THIN PLATES WELDING METHOD, BIMETALLIC THIN PLATES JOINTING ELEMENT, ELECTRIC DEVICE, AND ELECTRIC DEVICE ASSEMBLY
摘要 A bimetallic thin plate jointing element that is jointed, such that a good electric characteristics are maintained, is provided. Thin plate jointing element (10) is formed by welding and jointing positive-electrode terminal (1) and negative-electrode terminal (2) having different melting points, and having flexibility. A plurality of spot-like welding areas (3) formed, for example, by laser welding are provided at overlaid portion (9) of positive-electrode terminal (1) and negative-electrode terminal (2). Welding areas (3) are formed by irradiating laser beams from the side of positive-electrode terminal (1) having a relatively low melting point, and have a cross sectional shape that is tapered from the side of positive-electrode terminal (1) side toward negative-electrode terminal (2).
申请公布号 US2009223940(A1) 申请公布日期 2009.09.10
申请号 US20050573435 申请日期 2005.05.10
申请人 NEC CORPORATION 发明人 HOSOYA TOSHIZO
分类号 B23K26/00;B23K9/00 主分类号 B23K26/00
代理机构 代理人
主权项
地址