发明名称 HEAT DISSIPATING MODULE
摘要 A heat dissipating module includes a case, a fan, a heat dissipating part, at least one first fastening device, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide an air flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening. The first fastening device is located at the second air opening and disposed between the case and the heat dissipating part. The dust removal device has a side arm, and the side arm has a second fastening device that is capable of attaching to and detaching from the first fastening device.
申请公布号 US2009223652(A1) 申请公布日期 2009.09.10
申请号 US20080266541 申请日期 2008.11.06
申请人 LEE HSIANG-CHIH 发明人 LEE HSIANG-CHIH
分类号 F28D15/00 主分类号 F28D15/00
代理机构 代理人
主权项
地址