| 摘要 |
A method of manufacturing a semiconductor package is provided to realize a pump uniformly by forming a groove on a carrier substrate and manufacturing a pump as the shape of the groove through the groove. In a method of manufacturing a semiconductor package, a first circuit pattern having a bump which is arranged on a groove formed on the top of a carrier substrate is formed(S100). An insulating layer is formed to cover the first circuit pattern(S200), and a second circuit pattern electrically connected to the first circuit pattern is molded on the outer side surface of the insulating layer(S300). The carrier substrate is separated from the insulating layer(S400), and the bump is formed along the edge of the carrier substrate. |
