METHOD AND ELEMENT FOR SHIELDING HOUSING OF ELECTRONIC DEVICE

摘要

A method and a member for shielding a housing of an electronic device are provided to secure an electrical connection between a conductor layer of a shield member and a ground electrode by interposing a conductive adhesive between the conductor layer of the shield member and the ground electrode. A shield member(21) includes a base sheet(34) and an uncured adhesive layer(32). The base sheet is made of a synthetic resin film having heat resistance and electrical insulation property. A conductive layer(31) is formed on the base sheet by printing, coating, and sintering a conductive silver paste. The uncured adhesive layer is formed on the conductive layer. The uncured adhesive layer is attached to a housing(20) of an electronic device. The uncured adhesive layer is made of thermosetting resin having low melt viscosity.