METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD BY FORIMING A HARDENING RESIN LAYER

摘要

A manufacturing method of a PCB is provided to stably coat a photoresist on an insulation layer by forming a cured resin layer on the insulation layer. A base substrate having an inner layer circuit pattern is provided. An insulation layer(30) is formed on the base substrate. The insulation layer is made of thermosetting resin. A cured resin layer is formed on the insulation layer by a heating plate of high temperature. A raised carving pattern is formed on the cured resin layer. The raised carving pattern is filled in the insulation layer by a press plate. An intaglio pattern is formed by removing the raised carving pattern from the insulation layer. The insulation layer is cured. A circuit pattern(77) is formed by filling the intaglio pattern with conductive material.