| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling device and method that peels a sheet stuck on a plate-like member such as a semiconductor wafer without damaging the plate-like member. SOLUTION: The sheet peeling device peels a protective sheet F stuck on the semiconductor wafer W using an adhesive tape. A heat-sensitive adhesive tape is used as the adhesive tape, and bonded by thermocompression to an end of the protective sheet F by a heater tool. Then the adhesive tape is cut with a cutter blade, a heater cutter portion and a tape feed portion are elevated, and the adhesive tape is gripped by a peeling head 400, which is moved to pull and peel the protective sheet F. The peeled protective sheet F is discarded into a disposal box together with the adhesive tape. COPYRIGHT: (C)2009,JPO&INPIT |
