发明名称 |
ATOMIC LAYER EPITAXY APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To prevent a partial degradation in the film properties in a wafer face of a film formed by an atomic layer epitaxy process. SOLUTION: An atomic layer epitaxy apparatus 100 includes: a metal raw material gas feed tube 110 arranged at the lateral of a wafer 200 so as to spread over the whole face of the wafer 200 and fed with raw material gas from one end 110a in a direction toward the other end 110b; and a working gas feed tube 120 arranged at the lateral of the wafer 200 so as to spread over the whole face of the wafer 200 and fed with working gas from one end 120a in a direction toward the other end 120b. The working gas feed tube 120 is provided with a plurality of gas blow-off holes 122 jetting the working gas to be worked on the wafer 200, and the gas blow-off holes 122 are arranged so as to be gradually dense as it goes from one end 120a to the other end 120b in the working gas feed tube 120. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009203533(A) |
申请公布日期 |
2009.09.10 |
申请号 |
JP20080048061 |
申请日期 |
2008.02.28 |
申请人 |
NEC ELECTRONICS CORP |
发明人 |
IINO TOMOHISA;FUKUMAKI NAOMI;KATO YOSHITAKE |
分类号 |
C23C16/455;H01L21/205;H01L21/316 |
主分类号 |
C23C16/455 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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