| 摘要 |
PROBLEM TO BE SOLVED: To provide a method or the like for manufacturing a UV-IR cut filter to be mounted on a thin digital camera or a camera module of a cell phone with a camera, the filter hardly causing warpage of a substrate during manufacturing the filter even when a large area ultrathin substrate is applied as a substrate. SOLUTION: The method for an UV-IR cut filter for blocking UV light and near-IR light by combining an image pickup device comprising a CCD or a CMOS is characterized in that dielectric multilayer films having a dual-face symmetric structure are simultaneously formed on both surfaces of a large area ultrathin substrate having a ratio of the substrate thickness to the substrate diameter of not more than 1/2000, by an atomic layer deposition (ALD) method. Since each atomic layer is simultaneously deposited on both substrate surfaces by the above method and film stresses balance on both surfaces even if each layer has a film stress, the substrate hardly causes warpage even when the large area ultrathin substrate is applied. COPYRIGHT: (C)2009,JPO&INPIT
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