发明名称 ADHESIVE COMPOSITION AND ADHESIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition which can form an adhesive layer having high adhesive strength under a high-temperature environment, particularly at 200°C to 250°C. SOLUTION: The adhesive composition consists mainly of a polymer obtained by copolymerizing a (meth)acrylic acid alkylester composed of a chain structure with a monomer composition containing a monomer having a maleimide group. Thus, the adhesive composition forming an adhesive layer in which adhesive strength at high temperature is kept can be provided. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009203450(A) 申请公布日期 2009.09.10
申请号 JP20080106666 申请日期 2008.04.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ASAI TAKAHIRO;MISUMI KOICHI;OGATA HISAYUKI;TAKAHASHI MOTOKI;IMAI HIROFUMI
分类号 C09J133/06;C09J7/02;C09J125/04;C09J133/24 主分类号 C09J133/06
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