| 摘要 |
The disclosure relates to a carrier head for a chemical mechanical polishing apparatus (20). The carrier head (100) includes a housing (102), a base (104), a loading mechanism (108), a gimbal mechanism (106), and a substrate backing assembly (112). The substrate backing assembly includes a support structure (114) positioned below the base, a substantially horizontal, annular flexure (116) connecting the support structure to the base, and a flexible membrane (118) connected to the support structure. The flexible membrane has a mounting surface (274) for a substrate, and extended beneath the base to define a chamber (290). <IMAGE> |
