APPARATUS FOR COATING ADHESIVE

摘要

An apparatus for coating an adhesive is provided to increase the productivity of a semiconductor package by arranging one stencil mask on at least two substrates and coating an adhesive on the surface of two substrate. In an apparatus for coating an adhesive, a stencil mask module(100) comprises a body and a first and a second stencil mask formed on a body. A substrate fixed module(200) comprises a first fix table and a second fixed table fixing the substrate. A location information supply module(300) provides location information of the substrates and the first and second stencil masks. The alignment module(400) comprises a first alignment unit and a second alignment unit arranging substrate.