| 摘要 |
<p>An apparatus for inspecting edge area of a wafer, method using the same, and method for aligning the wafer are provided to improve the accuracy and repetition of rotation center by obtaining an image of a wafer and aligning rotation center. In an apparatus for inspecting edge area of a wafer, method using the same, and method for aligning the wafer, a wafer chuck is mounted on an upper side and is rotatable around a central axis. A wafer alignment unit turns the wafer mounted on the wafer chuck around the central axis of the wafer. A first image pickup unit is arranged on an upper part of the wafer and obtains an edge image of the wafer. A controller determines a defect of the wafer to be tested, and the wafer alignment unit is composed of a first image pickup unit(131), a lighting unit(154), and a wafer chuck driving part.</p> |
