THERMOCONDUCTIVE RESIN COMPOSITION, ADHESIVE LAYER, AND SEMICONDUCTOR DEVICE MANUFACTURED BY USING THEM

摘要

PROBLEM TO BE SOLVED: To provide a thermoconducticve resin composition which is excellent in the coating workability while showing the good curability and thermal conductivity and which has the little deterioration in the spredability after the application, and to provide a semiconductor device having an adhesive layer of a steady thickness and of few voids by using the thermoconductive resin composition.

SOLUTION: The thermoconductive resin composition contains a thermoconductive filler (A) having thermal conductivity of 10 W/mK or more, a compound (B) having a carbon-carbon double bond, and a compound (C) having a sulfide linkage and a hydroxy group; and the semiconductor device is manufactured by using the thermoconductive resin composition.

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