| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress malfunction of a conductive chip of an electronic component including the conductive chip and a spiral inductor. <P>SOLUTION: The present invention relates to the electronic component comprising an insulating substrate, the spiral inductor formed of a wiring layer formed on a lower surface of the insulating substrate, a first chip mounted on an under surface of the insulating substrate, electrically connected to the spiral inductor, and made of a conductive substrate, and a first raised portion provided on the upper surface or lower surface of the insulating substrate, projecting from the insulating substrate, and electrically connecting the spiral inductor or first chip to the outside. <P>COPYRIGHT: (C)2009,JPO&INPIT |
