| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated ceramic electronic component for ensuring the conductivity between a through-hole and an electrode terminal, and improving a bonding strength between a ceramic substrate and the electrode terminal, and its electronic component connection structure. <P>SOLUTION: The laminated ceramic electronic component 1 includes: the ceramic substrate 10 comprising a plurality of stacked ceramic layers; an inner lead 11 embedded into the substrate 10; the electrode terminal 12 formed on the outer surface of the substrate 10; and the through-hole 13 formed in the substrate 10 so as to provide the conductivity between the electrode terminal 12 and the inner lead 11. The electrode terminal 12 includes a plurality of different stacked terminal layers 120 having different material compositions. Out of the terminal layers 120, the terminal layer 120 for clamping at least one of the other terminal layers 120 with the substrate 10 is directly connected to the through-hole 13. <P>COPYRIGHT: (C)2009,JPO&INPIT |
