| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inter-board connector that achieves high density and reduction in height. <P>SOLUTION: Circuit boards 1A, 1B are respectively configured such that a conductive pattern 12 is formed on the surface of a board 11 formed of an insulating material while an umbrella-shaped bump 13 is formed on the conductive pattern 12. A connection board 2 is configured such that a plurality of conductive elastic bodies 22, respectively formed into a columnar shape by conductive rubber, are insert-molded to an insulating substrate 21 so as to integrally form the insulating substrate 21 and the conductive elastic bodies 22. A round through-hole 23 is formed at the center part of each conductive elastic body 22. The inside face of the through-hole 23 is formed with fitting grooves 24, 24 to which bumps 13 of the circuit boards 1A, 1B are protrusion-recess-fitted respectively, on axial both end sides. The conductive elastic body 22 is held by the insulating substrate 21 while exposing its both end parts to both side faces. Consequently, it is possible to connect each bump 13 to each fitting groove 24 at both end parts from both ends in the thickness direction of the insulating substrate 21. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
