发明名称 |
METHOD OF MANUFACTURING WIRING BOARD AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE |
摘要 |
A method of manufacturing a wiring board having a semiconductor chip mounting surface for mounting a semiconductor chip thereon which is manufactured by a process including a step of forming a wiring layer and an insulating layer on a support board and a step of removing the support board, including a peeling layer forming step of forming a peeling layer on the support board formed by a material having a coefficient of thermal expansion which is equal to that of a semiconductor substrate constituting the semiconductor chip, and a support board removing step of removing the support board by carrying out a predetermined treatment over the peeling layer.
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申请公布号 |
US2009223046(A1) |
申请公布日期 |
2009.09.10 |
申请号 |
US20090393478 |
申请日期 |
2009.02.26 |
申请人 |
SHINKO ELECTRIC INDUSTRIES, CO., LTD. |
发明人 |
MURAYAMA KEI;HIGASHI MITSUTOSHI;SUNOHARA MASAHIRO |
分类号 |
H05K3/02 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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