| 摘要 |
A chip package structure includes a carrier substrate having a circuit in both front side and the reverse side; each chips includes a plurality of pads is arranged near the central region on the active surface; and a polymer material is used to cover the chips and the carrier substrate, the characteristic in that: the circuit of the front side is electrically connected to a plurality of first conductive points and a plurality of metal terminals by a plurality of metal trace, in which the plurality of metal trace is arranged on the reverse side by way of through hole on the carrier substrate, and the plurality of metal terminals of the reverse is electrically connected to the plurality of second conductive points by the plurality of second metal trace, in which the plurality of pads of the chips is electrically connected to the plurality of first conductive points and the part of metal terminals is to be exposed.
|
