Method for determining parameter by application of wafers, involves removing wafers from reservoir with arm of robot, and wafer is positioned at part in image field of camera and lies on arm of robot

摘要

The method involves removing wafers from a reservoir with an arm of a robot. The wafer is positioned at a part in an image field of a camera and lies on the arm of the robot. An image is included in a camera before the operation of the wafer at an inspection station (3) and is determined from the included image by image processing of the parameter. An independent claim is included for a device for regulation of a parameter during the handling of wafer.